The inspection of multi-chip modules (MCM) can often present uniquely challenging metrology requirements because of the need to accurately control many diverse factors for multiple die on a common substrate, such as die location, die height at the corners, verification of wire counts for each die, and die-to-substrate alignment characteristics. Because of the range of die types, dimensions, and locations as well as reflection and texture differences between die and substrate surfaces, important metrology features include versatile optics and lighting as well as advanced edge detection and image processing capabilities. In addition, optional stage sizes and high-precision motion can be critical to achieving the required balance of accuracy and throughput.

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