Mis-registration of solder paste relative to printed circuit board pads is one of the leading causes of scrap and rework in surface mount technology (SMT) board assembly. In addition, height and volume measurements are crucial to new process development and to the optimization of existing processes. The epoxy glue dot process used to fix the location of components before the reflow soldering process shares similar requirements. The ability to import CAD file representations of the desired paste and dot locations satisfies a key ease-of-use requirement.

Solder Paste Metrology

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