Metrology Applications for Semiconductor Manufacturing and Advanced Packaging

Driven by VIEW Micro-Metrology’s solutions-oriented leadership, high-performance and flexibly configurable non-contact metrology platforms have become critical parts of today’s leading-edge semiconductor manufacturing and advanced packaging production environments.

VIEW Micro-Metrology metrology solutions are already leading the way in leading-edge non-contact quality assurance processes for demanding semiconductor manufacturing and advanced packaging applications.

• Wafer-level Inspection
• Bump On Die
• Flip Chip
• Electrical Test Probes
• Chip Carriers
• Multi Chip Modules & Hybrid Circuits
• QFPs & BGAs
• FED Hole Measurement