Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance systems. Coplanarity, lead width, pitch, ball diameter, package height and warpage, and the need to inspect for damaged or missing balls/leads can all be critical factors. In addition to the needs for versatile lighting and high-performance image processing, effective QFP/BGA inspection also requires integrated laser capabilities for rapid and accurate Z-axis measurements.