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The wide variety of interconnection methodologies used in today’s electronics and microelectronics applications are pushing metrology inspection
capabilities to new levels of accuracy and adaptability. Whether the specific technology involves wire bonding, flex circuits, fiber optic ferrules, PCB card-edge, or
motherboard connectors, the metrology challenges for accuracy and flexibility are becoming more demanding every day.
As the leader in microelectronics metrology solutions for more than two decades, VIEW Micro-Metrology brings together the applications awareness and metrology
expertise needed to address even the most demanding interconnection challenges with proven platforms. Some of the specific microelectronics interconnection
applications that are addressed by VIEW Micro-Metrology solutions are listed below.
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